Type

HHPD032-A

HHPD032-B

HHPD025-A

HHPD025-B

HHPD012-A

HHPD010-A

HHPD010-B

HHPD010-C

HHPD005-A

Diameter

(mm)

48.0

Total Thickness

(mm)

1.0/1.2/1.6/2.0/2.5/3.2

PCD Layer Thickness

(mm)

0.5±0.15

Average Grain Size

(μm)

30+2

30+2

25

25

10+2

10

10

10

5

Characters

Extremely high abrasive resistance. Impact toughness is strengthened by the order of 025-A,025-B,032-A and 032-B, EDM cutting performance is strengthened by the order of 025-A,032-A,032-B and 025-B

Combining high abrasive resistance, impact toughness and high degree of surface finish. Abrasive resistance is strengthened by the order of 010-C,010-B,012-A and 010-A. Impact toughness is strengthened by the order of 010-A,012-A,010-B and 010-C, EDM cutting performance is strengthened by the order of 010-A,012-A,010-C and 010-B.

High impact toughness, suitable for EDM cutting, extremely high degree of surface finish.

Application

Used in highly abrasive materials, such as ceramic, hard metal, silicon carbide, stone and laminate flooring.

Specially used in chipboard and other places where require rough feed.

Used in laminate flooring, density board, carbon fiber materials, silicon carbide, high-silica aluminum alloy.

Used in the manufacturing of common wood saw blade and  products requiring EDM. cutting.

Used in fine processing of circuit boards, silicon-aluminum alloy and copper alloy.

Used in processing of wood, circuit boards, low silicon-aluminum alloy and fine ceramics.

Used in manufacturing all kinds of segments with EDM cutting.

Used in the  places with fine processing where require rough feed and low abrasive resistance.

Used in the places where require high degree surface finish, such as low silicon-aluminum alloy, non-ferrous metal, semiconductor and plastic.

 nonstandard products is available on request